SAE ARP1612 Revision A

SAE ARP1612 – Revision A – Polyimide Printed Circuit Boards Fabrication of

This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyamide printed wiring boards. Included are recommendations for both double-sided and multi-layer boards. The processes described herein are the result of extensive evaluation and manufacturing experience. These recommendations reflect procedures that have proven effective in producing low-cost and reliable printed wiring boards.

Product Details

Published:

06/05/2022

File Size:

1 file , 1 MB

Note:

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