SAE AMS3690 Revision C

SAE AMS3690 – Revision C – Adhesive Compound, Epoxy Room Temperature Curing

This specification covers a two-component compound, an epoxy resin base and a hardener, in the form of a paste.

This adhesive compound has been used typically for non-structural bonding of metallic alloys and thermosetting plastics to themselves and to each other; it is intended primarily as an adhesive for electrical components nd devices operating at not higher than 185 mDF (85 mDC), but usage is not limited to such applications.

Product Details

Published:

07/20/2009

File Size:

1 file , 82 KB

Note:

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