SAE AMS2690 Revision C

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Parallel Gap Welding Microelectronic Interconnections to Thin Film Substrates

standard by SAE International, 10/03/2011

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SAE AMS2690 – Revision C – Parallel Gap Welding Microelectronic Interconnections to Thin Film Substrates

This specification defines the equipment, procedures, and requirements for joining leads by parallel gap resistance welding. For attaching leads by parallel gap resistance welding in the assembly of microelectronic circuitry to thin film substrates.

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Published:
10/03/2011
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1 file , 76 KB
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